Attendance List: 802.16 Session 7: 1-5 May, 2000

  1. #*Bakri Aboukarr, Newbridge Networks Corporation, USA
  2. #*Adnan Abu-Dayya, AT&T Wireless Services, USA
  3. #Sherman Ackley, National Rural Telephone Cooperative, USA
  4. #*Reza Arefi, Wireless Facilities, Inc., USA
  5. Donald Arnstein, Hughes Network Systems, USA
  6. #*Arun V. Arunachalam, Nortel Networks, USA
  7. #Malik Audeh, Hybrid Networks, Inc., USA
  8. #*Eli Avivi, WaveIP Ltd., ISRAEL
  9. #Daniel J. Azaren, TRW Space & Electronics Group, USA
  10. #*Paolo Baldo, Siemens Information and Communication Networks S.p.A., ITALY
  11. #Jean-Pierre Balech, Alcatel CIT, FRANCE
  12. #*Jay Bao, Mitsubishi Electric ITA, USA
  13. #*Ian Baragar, Nortel Networks, CANADA
  14. #*Behshad Baseghi, Malibu Networks, USA
  15. #*Anader Benyamin-Seeyar, Harris Corporation, CANADA
  16. #Lamar Bishop, GartnerConsulting, USA
  17. Yair Bourlas, Ensemble Communications Inc., USA
  18. #*Chris S. Brown, EndWave Corporation, USA
  19. #*Carl J. Bushue, Sprint, USA
  20. #*Baruch A. Buskila, WaveIP Ltd., ISRAEL
  21. #*Rebecca S.M. Chan, Industry Canada, CANADA
  22. #*Dean S.K. Chang, Aperto Networks, USA
  23. #Naftali Chayat, BreezeCOM, ISRAEL
  24. #*Rémi Chayer, Harris Corporation, CANADA
  25. #*Hokyu Choi, Samsung Electronics Co., Ltd., KOREA
  26. #Hoon Choi, NIST, USA
  27. #*Rahul Chopra, Gigabit Wireless Inc., USA
  28. #Narisa Chu, C&W Systems, Ltd., USA
  29. #Craig Cigard, Sprint, USA
  30. #*Cyril Clavelin, NIST, USA
  31. #*Ron Coles, Digital Microwave Corporation, USA
  32. #*Mary Condie, Newbridge Networks Corporation, CANADA
  33. #William J. Crilly, Agilent Technologies, USA
  34. #Kevin Curtis, NEC America, Inc., USA
  35. #*Panos I. Dallas, INTRACOM S.A., GREECE
  36. #Joe DeCamp, Motorola, USA
  37. #Daniel F. DiFonzo, Paratek Microwave, Inc., USA
  38. #*Edward Doherty, Corian Inc., USA
  39. #*Amos A. Dotan, WaveIP Ltd., USA
  40. #Keith Doucet, Vyyo Inc., USA
  41. #*Roger Durand, Cabletron Systems, USA
  42. #*Carl Eklund, Nokia Research Center, FINLAND
  43. #*Kamran Etemad, Wireless Facilities, Inc., USA
  44. #*Allan Evans, Netro Corporation, USA
  45. #Khaled Fazel, Marconi Communications GmbH, GERMANY
  46. #*George R. Fishel, Communications Consulting Services, USA
  47. #*Adrian Florea, Newbridge Networks Corporation, CANADA
  48. #*Jeffrey R. Foerster, Newbridge Networks Corporation, USA
  49. #*Thomas B. Fulton, HighSpeed.Com, USA
  50. #*Hiroshi Furukawa, NEC Corporation, JAPAN
  51. #*Vijaya Gallagher, WirelessHome Corp., USA
  52. #*G. Jack Garrison, Wavtrace, Inc., USA
  53. #*Richard Germon, Nottingham Trent University, UK
  54. #*Marianna Goldhammer, BreezeCOM Ltd., ISRAEL
  55. #*Conrad Grell, TurboNet Communications, USA
  56. #*Ian Grier, ST Telecom, CANADA
  57. #Phil Guillemette, Spacebridge Networks Corp., CANADA
  58. #*Itzhak Gurantz, Conexant Systems, Inc., USA
  59. #*Zion Hadad, Runcom Ltd., ISRAEL
  60. #Jehuda Haklai, Ultracom Communications Holdings (1995) Ltd., ISRAEL
  61. #*Baruch Halachmi, RADWIN, USA
  62. #*A. Roger Hammons, Jr., Hughes Network Systems, USA
  63. #*Dan Hilberman, Caly Corp., USA
  64. #*Robert Huang, Matsushita/Panasonic, USA
  65. #*Wayne Hunter, Crosspan Network Access Technologies, USA
  66. #*Hossein Izadpanah, HRL Laboratories, USA
  67. #*Eric Jacobsen, Intel Corp., USA
  68. #*Hamadi Jamali, Canon Research Center America, Inc., USA
  69. #*Leif Jansson, Ericsson Radio Systems AB, SWEDEN
  70. #*Vladan Jevremovic, U S WEST Advanced Technologies, USA
  71. #*Jacob W. Jorgensen, Malibu Networks, USA
  72. #Thierry Journe, France Telecom R&D, FRANCE
  73. #*Inchul Kang, Malibu Networks, USA
  74. #*Mika Kasslin, Nokia Research Center, FINLAND
  75. #*Brian G. Kiernan, InterDigital Communications Corp., USA
  76. #*John Kim, Georgia Institute of Technology, USA
  77. #*Ahmet Kirac, Lucent Technologies, USA
  78. #*Allan Klein, SR Telecom Inc., CANADA
  79. #*Jay Klein, Ensemble Communications Inc., USA
  80. #*Thomas J. Kolze, Broadcom Corp., USA
  81. #*Demosthenes Kostas, Adaptive Broadband Inc., USA
  82. #*Tomoaki Kumagai, NTT, JAPAN
  83. #John Langley, Com21 Inc., USA
  84. #*J. Leland Langston, Crosspan Network Access Technologies, USA
  85. #*Israel Lavie, Ultracom Communications Holdings (1995) Ltd., ISRAEL
  86. #*Yigal Leiba, BreezeCOM Ltd., ISRAEL
  87. #Nikolai Leung, QUALCOMM, Inc., USA
  88. #*Barry Lewis, Radiocommunications Agency, UK
  89. #*Sergio Licardie, Digital Microwave Corporation, USA
  90. #*John Liebetreu, SiCOM, Inc., USA
  91. #*Lars Lindh, Nokia Research Center, FINLAND
  92. #*Willie Lu, Infineon Technologies Corp., USA
  93. #*J. Scott Marin, SpectraPoint Wireless LLC, USA
  94. #*Roger B. Marks, NIST, USA
  95. #Christophe Martin, Alcatel, FRANCE
  96. #Ham Matthews, ADC Telecommunications, USA
  97. #*Ronald Meyer, Crosspan Network Access Technologies, USA
  98. #Nader Moayeri, NIST, USA
  99. #*Apurva Mody, Georgia Institute of Technology, USA
  100. #*Sanjay Moghe, RF Solutions, USA
  101. #*James F. Mollenauer, Technical Strategy Associates, USA
  102. #*Anton Monk, Conexant Systems, Inc., USA
  103. #*Ron Nadiv, Giganet, ISRAEL
  104. #Sanjay Nagdev, MCI WorldCom, USA
  105. #*Avi Nudler, TelesciCOM Ltd., ISRAEL
  106. #*John Ohlson, Newbridge Networks, USA
  107. #*Ryutaro Ohmoto, Nippon Telegraph and Telephone Corporation, USA
  108. #*Nicholas Oros, Motorola, USA
  109. #*Yunsang Park, Hughes Network Systems, USA
  110. #Chris Pawlowski, Wireless Home, Inc., USA
  111. #Jon Peha, Carnegie Mellon University, USA
  112. #Bertrand Penther, Mitsubishi Electric ITE, FRANCE
  113. #*Brian Petry, 3Com Corp., USA
  114. #Juha Pihlaja, Nokia Research Center, FINLAND
  115. #Shlomo Rakib, Terayon Communication Systems, USA
  116. #*Moshe Ran, TelesciCOM Ltd., ISRAEL
  117. #*Stanley Reible, Proxim, Inc., USA
  118. #*Valentine Rhodes, Intel, USA
  119. #*David B. Ribner, Analog Devices, Inc., USA
  120. #*Gene Robinson, E. A. Robinson Consulting, Inc., USA
  121. #Jeff Rosenblatt, WinStar Communications, Inc., USA
  122. #*Ted Rzeszewski, Motorola, USA
  123. #Phillips Taylor Salman, Opnet, USA
  124. #*Ray W. Sanders, CircuitPath Network Systems, USA
  125. #*Durga P. Satapathy, Sprint, USA
  126. #*Glen E. Sater, Motorola Inc., USA
  127. #*Vito Scaringi, Newbridge Networks Corporation, CANADA
  128. #*David Schafer, Wavtrace, Inc., USA
  129. #Mutsuma Serizawa, Toshiba Corp., JAPAN
  130. #*Chaim Shenhav, nBand Communications, USA
  131. #*Chet Shirali, Vyyo Inc., USA
  132. #*George Stamatelos, Nortel Networks, CANADA
  133. #*Karl Stambaugh, Motorola Inc., USA
  134. #Ken Stanwood, Ensemble Communications Inc., USA
  135. #*Paul F. Struhsaker, World Access Inc., USA
  136. #*Gordon Stuber, Georgia Institute of Technology, USA
  137. #David A. Sumi, Wireless, Inc., USA
  138. #*Andrew Sundelin, iSKY, Inc., USA
  139. #Hiroshi Takatori, Level One Communications, Inc., USA
  140. #*Kimiya Tateishi, NEC America,Inc., USA
  141. #*Paul Thompson, Paul Thompson Associates, USA
  142. #Stuart Thomson, Broadcom Corporation, USA
  143. #*David Trinkwon, Transcomm Inc., USA
  144. #David Unger, Broadband Access Systems, Inc., USA
  145. #*Jack Van der Star, Belstar Systems Corp., USA
  146. #*Nico van Waes, Nokia Networks, USA
  147. #Subir Varma, BNA Systems, USA
  148. #*Phuong Vu, Industry Canada, CANADA
  149. #*Muya Wachira, Nortel Networks, USA
  150. #*Chao-Chun Wang, Malibu Networks, USA
  151. #*Philip Whitehead, Radiant Networks PLC, UK
  152. #Robert R. Whiting, Gabriel Electronics, USA
  153. *David Williams, Advanced Hardware Architectures, USA
  154. #Kebing Yang, IoWave, Inc., USA
  155. #*Huanchun Ye, Newbridge Networks, USA
  156. #*Jung Yee, Philsar Semiconductor Inc., CANADA
  157. #*Wei Zhang, NIST, USA
  158. #*Juan Carlos Zuniga, Harris Corporation, CANADA

*Met 75% presence requirement for "participation" credit (116 people). Direct questions to the Secretary.

#Paid registration fee, according to most recent records.

Return to Session #7 Page