Registration List: 802.16 Session #12: 12-15 March 2001

The following registered for and attended Session #12:
  1. *Omer Acikel, Solectek Corp.
  2. *Gordon Antonello, Wi-LAN Inc.
  3. *S. Lek Ariyavisitakul, Broadband Wireless Solutions
  4. *Jori Arrakoski, Nokia Networks, FINLAND
  5. *Malik Audeh, Hybrid Networks, Inc., USA
  6. *Drayt Avera, RF Solutions, USA
  7. Yehude Azenkot, Terayon
  8. *C.R. (Rick) Baugh, Harris Communications, Inc., USA
  9. *Yvon Belec, Wavesat Telecom, CANADA
  10. *Carlos Belfiore, DMC Stratex Networks, Inc., USA
  11. *Anader A. Benyamin-Seeyar, Harris Corporation Inc., CANADA
  12. *Burcak Beser, Pacific Broadband Communications, USA
  13. *Dale Branland, BeamReach Networks, Inc.
  14. *James Brennan, Mabuhay Networks, Inc., USA
  15. *Michael Buckley, Clearwire Technologies Inc.
  16. *Carl J. Bushue, Sprint, USA
  17. *Baruch D. Buskila, WaveIP Ltd., ISRAEL
  18. *Lowell Campbell, Denso International America, Inc.
  19. *Gregory S. Caso, Escape Communications, USA
  20. *Dean S.K. Chang, Aperto Networks, USA
  21. *Kai Chang, Aperto Networks, USA
  22. *David C. Chauncey, Clearwire Technologies Inc., USA
  23. *Naftali Chayat, BreezeCOM Ltd., ISRAEL
  24. *Rémi Chayer, Harris Corporation, CANADA
  25. *Ronald D. Coles, DMC Stratex Networks, Inc., USA
  26. *William J. Crilly, Jr., Mabuhay Networks, USA
  27. Michael J. Donahue, Western Multiplex, USA
  28. *Amos A. Dotan, WaveIP Ltd., ISRAEL
  29. *Keith Doucet, Vyyo Inc., USA
  30. Jeff Dunnihou, Cirrus Logic
  31. *Brian S. Edmonston, iCoding Technology Inc., USA
  32. *Brian Eidson, Conexant Systems, Inc., USA
  33. *Carl Eklund, Nokia Research Center, FINLAND
  34. *Hesham El-Damhougy, Western Multiplex, USA
  35. *Ruder Erez, Innowae ECI
  36. *David A. Fisher, Radia Communications, USA
  37. *Robert Foster, Wavtrace, Inc., USA
  38. *Avraham Freedman, Hexagon System Engineering, ISRAEL
  39. *G. Jack Garrison, Harris Corporation, CANADA
  40. *Andrew Garrott, Advanced Hardware Architectures
  41. *Brian Gieschen, Wi-LAN Inc.
  42. *Marianna Goldhammer, BreezeCOM Ltd., ISRAEL
  43. *Phil Guillemette, SpaceBridge Networks Corp., CANADA
  44. *Zion Hadad, Runcom Technologies Ltd., ISRAEL
  45. *Joseph Hakim, Aperto Networks, USA
  46. *Baruch Halachmi, RADWIN Ltd., ISRAEL
  47. *Moritz Harteneck, Infineon Technologies AG, GERMANY
  48. *Yoav Hebron, Conexant Systems, Inc., USA
  49. *Bob Heise, Wi-LAN Inc., CANADA
  50. *Michael Hirano, AT&T Wireless Group
  51. *Coleman Hum, Alcatel, CANADA
  52. *Wayne Hunter, Crosspan Network Access Technologies, USA
  53. *David F. Husson, WIDAX Corporation, USA
  54. *Du Wayne Jackson, Widax Corporation, USA
  55. *Eric Jacobsen, Intel Corp., USA
  56. *Hamadi Jamali, Canon R&D Center Americas, Inc., USA
  57. *Jacob W. Jorgensen, Malibu Networks, USA
  58. *Tal Kaitz, BreezeCOM Ltd.
  59. *Phil Kelly, BeamReach Networks, Inc.
  60. *Brian G. Kiernan, InterDigital Communications Corp., USA
  61. *John Kim, Georgia Institute of Technology, USA
  62. *George A. Kipens, Alcatel, CANADA
  63. *Itzik Kitroser, Runcom Technologies Ltd., ISRAEL
  64. *Jay Klein, Ensemble Communications Inc., USA
  65. Anthony Klinkert, WorldCom Broadband Solutions
  66. *Thomas J. Kolze, Broadcom Corp., USA
  67. *Demosthenes Kostas, Adaptive Broadband Inc., USA
  68. *Jason Krasnow, Solectek Corp.
  69. *Jerry Krinock, Radia Communications
  70. *Rajeev Krishnamoorthy, Iospan Wireless
  71. *Jonathan Labs, Wavesat Telecom Inc
  72. *John B. Langley, Com21 Inc., USA
  73. *Ludovic Lauer, Philips
  74. *Chin-Chen Lee, Radia Communications, USA
  75. *Minfei M. Leng, Clearwire Technologies Inc., USA
  76. *Moshe Levinson, Runcom Technologies Ltd.
  77. *Xiaodong Li, Broadstorm
  78. *Zhi-Jian Li, Worldcom
  79. *Sergio R. Licardie, DMC Stratex Networks, Inc., USA
  80. *John M. Liebetreu, Intersil Corporation, USA
  81. *Lars Lindh, Nokia Research Center, FINLAND
  82. *Huz Liu, Broadstorm
  83. Titus K. Lo, AT&T Wireless Group, USA
  84. *Hui-Ling Lou, Marvell
  85. *Willie Lu, Infineon Technologies Corp., USA
  86. *Heinz Lycklama, Siros Networks, USA
  87. *Osamu Maeshima, KDDI R&D Laboratories Inc., Japan
  88. *Robert C. Malkemes, Sarnoff Corporation, USA
  89. *Roger B. Marks, NIST, USA
  90. *Ronald D. McCallister, Intersil Corporation, USA
  91. *Russell C. McKown, Raze Technologies, USA
  92. *Sushil Mehta, Lockheed Martin Global Telecommunications,
  93. *Ronald L. Meyer, Crosspan Network Access Technologies, USA
  94. *Andrew C Middleton, Airspan Communications Ltd., UK
  95. *Vlad Mitlin, 3Com Corp., USA
  96. *Apurva N. Mody, Georgia Institute of Technology, USA
  97. *Sanjay Moghe, RF Solutions, USA
  98. Steve Morhus, Wiman Systems
  99. *Ron Murias, Wi-LAN Inc.
  100. *Jim Nadeau, Malibu Networks
  101. *Robert R. Nelson, Raze Technologies, USA
  102. *Kim Olszewski, Denso International America, Inc.
  103. *Uzi Padan, InnoWave ECI Wireless Systems Ltd., ISRAEL
  104. *Panos Panagiotopoulos, Intracom S.A.
  105. Roger Pandanda, MCS Corp., USA
  106. Manish Patel, Navini Network
  107. *Kenneth L. Peirce, Malibu Networks, USA
  108. *Subbu Ponnuswamy, Malibu Networks, USA
  109. *Pierre Poulin, Wavesat Telecom Inc
  110. *Vicente E. Quilez, Alcatel, SPAIN
  111. *Manouchehr Rafie, Caly Networks, USA
  112. *William T. Ralston, , USA
  113. *Moshe Ran, TelesciCOM Ltd., ISRAEL
  114. *Dave Reed, Channel Technology
  115. *Einan Regev, Wavion, ISRAEL
  116. *Stanley Reible, Oak Wireless, USA
  117. *Mark Reudink, Vectrad Networks, USA
  118. *Valentine J. Rhodes, Intel Corporation, USA
  119. David B. Ribner, Analog Devices, Inc., USA
  120. *Fred Ricci, WinStar Communications, Inc., USA
  121. Hal Roberts, ADC
  122. *Walt Roehr, InterDigital/TNC, USA
  123. *Amir Sarajedini, BeamReach Networks, Inc.
  124. *Octavian Sarca, Redline Communications Inc., CANADA
  125. *Hikmet Sari, Pacific Broadband Communications, FRANCE
  126. *Durga P. Satapathy, Sprint, USA
  127. *Carl G. Scarpa, Hitachi America R&D, USA
  128. *Andy Schiltz, Ensemble Communications, Inc., USA
  129. *Randall C. Schwartz, BeamReach Networks, Inc., USA
  130. *Dan Schwob, Channel Technology
  131. *Baker Scott, Channel Technology
  132. *Yossi Segal, Runcom Technologies Ltd., ISRAEL
  133. *Radu B. Selea, Redline Communications Inc., CANADA
  134. *Olivier B. Seller, SACET, FRANCE
  135. *Menashe Shahar, Vyyo Ltd., ISRAEL
  136. *Tie-Jun Shan, Lucent Technologies, USA
  137. *David Shani, TelesciCOM Ltd., ISRAEL
  138. Jun Shen, Aperto Networks, USA
  139. *Chaim Shenhav, nBand Communications, USA
  140. *Jon Shields, Solectek Corp.
  141. *Chet Shirali, Vyyo Inc., USA
  142. *James M. Simkins, Xilinx, USA
  143. *Manoneet Singh, Radia Communications, USA
  144. *Ken Singleton, PipingHot Networks, UK
  145. *Gary Smith, Worldcom
  146. *Steven R. Smith, Intersil Corporation, USA
  147. *Sean Sonander, Advanced Hardware Architectures, UK
  148. *Ken Stanwood, Ensemble Communications Inc., USA
  149. *Michael Stewart, Escape Communications, USA
  150. *Paul F. Struhsaker, Raze Technologies, USA
  151. *John Sydor, Industry Canada/Communications Research Centre, CANADA
  152. *Joseph Tavormina, Weston Multiplex
  153. *Shawn Taylor, Wi-LAN Inc.
  154. *Jonathan Thompson, Airspan Communications Ltd.
  155. Stuart A. Thomson, Broadcom Corp., USA
  156. Katsumi Tokuyama, Key Stream Co., Ltd
  157. *Anish A. Tolia, Oren Semiconductor Ltd., USA
  158. *David B. Trinkwon, Transcomm Inc, USA
  159. *Nico Van Waes, Nokia Networks, USA
  160. *Subir Varma, Aperto Networks, USA
  161. Rajiv Vijayan, Qualcomm Inc.
  162. *Arthur W. Wang, WirelessHome Inc., USA
  163. *Chao-Chun Wang, Pacific Broadband Communications, USA
  164. *Lei Wang, Wi-LAN Inc., CANADA
  165. *Stanley Wang, Ensemble Communications, USA
  166. *Robert M. Ward, SciCom, Inc., USA
  167. *Larry L. Watkins, Speedcom Wireless, USA
  168. *Mati Wax, Wavion
  169. *Philip Whitehead, Radiant Networks PLC, UK
  170. *Robert R. Whiting, Gabriel Electronics, USA
  171. *David G. Williams, Advanced Hardware Architectures, USA
  172. *Vladimir Yanover, BreezeCOM Ltd., ISRAEL
  173. *Huanchun Ye, BeamReach Networks, Inc., USA
  174. *Charles You, Mitsubishi Electric, USA
  175. *Yoram Zarai, Terayon
  176. *Wenhan Zhang, Legend Silicon Corp., USA
  177. *Juan Carlos Zuniga, Harris Corporation, CANADA
  178. *Paul Zyskowski, Intel
*Met 75% presence requirement for "participation" credit. Direct questions to the Secretary.
Return to Session #12 Page