Meeting Materials
Trey Malpass
Huawei
Scott Kipp
Marco Ghisoni
Brocade
Zarlink Semiconductor
Wenbin Jiang, DC Sun and EJ Mao
JDSU
Alan Benner and Petar Pepeljugoski
IBM
Trey Malpass, Zeng Li and Zhong Qiwen
Osamu Ishida
Shoukei Kobayashi
NTT
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