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What is this: “I do not think this is a choice in the P2P ad hoc survey but it should be”? Is there a plan to do some sort of survey? Can you provide details?
Chad Jones
MGR, HW ENG, Cisco Systems
Chair, IEEE P802.3bt 4PPoE Task Force
From: <Darshan>, Yair Darshan <YDarshan@xxxxxxxxxxxxx>
Reply-To: Yair Darshan <YDarshan@xxxxxxxxxxxxx> Date: Monday, April 28, 2014 at 7:42 AM To: 4PPOE Reflector <STDS-802-3-4PPOE@xxxxxxxxxxxxxxxxx> Subject: Re: [802.3_4PPOE] Channel P2P RUNB - Ad-hoc list of attendees - UPDATE Hi Fred, Thanks for your inputs. So you prefer? a)
Single worst case number at room temperature? b)
Single worst case number at TBD low temperature were this low temperature represents wide market applications? (and no further text/inputs/requirements/guidelines for lower
than that minimum temperature point?) c)
Else? I understand from your response that you prefer option (b)? Yair From: Fred Schindler [mailto:grog06@xxxxxxxxx]
Hello Pair-to-Pair Ad Hoc, I think adding temperature details to the IEEE .3BT specification will result in problems. Stating values at temperature is not standard for IEEE specifications.
Not all vendors will operate in the same temperature range. Requirements should be provided for interoperable operation. Some of this may be arrived at by considering temperature for the broader market. Vendors with wider operational
needs will need to use cable made for the application and tested with .3BT requirements. Guidance for cable parameters should reference cable standards. The .3BT standard should provide guidance on how to use cable standard values for the .3BT standard. ð
I do not want parameters for specific temperatures in the requirements of the .3BT specification.
I do not think this is a choice in the P2P ad hoc survey but it should be. That is, I do not want this information in the appendix either as this will require .3BT to wait for cable standards to provide the values. Values in the appendix
are not tested. Thanks for your consideration, Fred Schindler From: Darshan, Yair [mailto:YDarshan@xxxxxxxxxxxxx]
Hi all, Please review if I missed your name in the list of attendees on last Thursday a-hoc meeting. Thanks Yair ----
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David Tremblay / HP ------ Darshan Yair Chief R&D Engineer Analog Mixed Signal Group Microsemi Corporation 1 Hanagar St., P.O. Box 7220 Cell: +972-54-4893019 E-mail: <mailto:ydarshan@xxxxxxxxxxxxx>. |