IEEE 802.3af DTE Power via MDI Task Force
May 2000 Interim meeting

May 24-25, 2000
Ottawa, ON

Meeting Minutes
Agenda and Introductory Remarks

Liaison Letters

TR-42 - Engineering Committee on User Premises Telecommunications Infrastructure
46K


TR-41.4 - Subcommittee on VoIP Gateways and Infrastructures
4K

Presentations

DTE power via MDI, an Alternative Proposal
186K

Hans Sitte

Agilent Technologies


Basic Methods for DTE Power Delivery
430K

Ed Walker

TI


Powering and Detection Alternatives
95K

Arlan Anderson

Nortel Networks


IEEE 802.3 DTE Power via MDI Detection and Signature Protocol
78K

Richard Glaser
John Jetzt
Dieter Knollman
Robert Leonowich
Donald Stewart

Lucent
Lucent
Lucent
Lucent
Lucent


Update on Diode Discovery Process
210K

Robert Muir

Level One


Common Mode and Differential Mode Discovery Techniques
288K

Rick Brooks

Nortel


Power over the MDI, Mid Span Powering
73K

Karl Nakamura
Roger Karam

Cisco
Cisco


Power over the MDI using the two Signal Pairs
358K

Karl Nakamura
Roger Karam

Cisco
Cisco


User Requirements for Cabling Support
11K

Robert Love
Dave Kooistra

LAN Connect Consultants
IBM


DTE Power via MDI
122K

Gerard Vergnaud
Raymond Gass
Remy Jaeger

Alcatel
Alcatel
Alcatel


Physical Layer Topology considerations for DTE power over MDI
13K

Sterling Vaden

Superior Modular Products


DTE Power over MDI: Building Consensus
90K

Ralph Andersson
Daniel Dove
Robert Muir

TDK Semiconductor
Hewlett Packard
Level One Communications


Consensus Proposal
74K

Daniel Dove

Hewlett Packard


Isolation considerations for MDI power sources and MDI-powered DTE
68K

John Jetzt
Donald Stewart

Lucent Technologies
Lucent Technologies


Return Loss with Mid-Span Insertion
121K

Mike Nootbaar
Steve Gorman

TDK
TDK


Midspan Power Insertion Using Transformer Coupling
74K

Kevin Brown

Broadcom


DTE Detection Revisited
28K

Kevin Brown

Broadcom


IEEE 802.3af Remote Powering Considerations
119K

Amir Lehr
Yair Darshan
Avinoam Levy

PowerDsine
PowerDsine
PowerDsine


Preliminary Simulation Results for the Diode Discovery Process
960K

Daniel Dove

Hewlett Packard


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Last Update: 07 Jun 00


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