# | Presenter | Company | Presentation Title | File |
All files in zip format (5.0 MB) | 3av_0811_all_files.zip | |||
IEEE 802.3 Work Group Meeting | ||||
Glen Kramer | Teknovus | IEEE 802.3 Plenary Opening Session P802.3av Task Force Report |
1108_av_open_report.pdf | |
Glen Kramer | Teknovus | IEEE 802.3 Plenary Closing Session P802.3av Task Force Report and Motions |
1108_av_close_report.pdf | |
Liaison letter from ITU-T SG15 to 802.3 COM15-LS01-E regarding interworking of G.984 and P802.3av | 1108_ITU_SG15_to_802_3_LS01.pdf | |||
Liaison letter from SCTE IPS WG5 to 802.3 regarding RF signals over glass (RFoG) access network | 1108_SCTE_IPS_WG5_to_802_3.pdf | |||
Agenda, Minutes, and General Information | ||||
Glen Kramer | Teknovus | Meeting Agenda | 3av_0811_agenda.pdf | |
Eric Lynskey | Teknovus | September 2008 Meeting Minutes (Approved) | 3av_0809_minutes_approved.pdf | |
November 2008 Meeting Minutes (Unapproved) | 3av_0811_minutes_unapproved.pdf | |||
Comment 2663 - Roll Call | 3av_0811_2663_roll_call.pdf | |||
Lowell Lamb | Teknovus | Draft liaison response to SCTE IPS WG5 | 3av_0811_SCTE_IPS_response.pdf | |
Glen Kramer | Teknovus | Task Force Motions and Closing Remarks | 3av_0811_TF_closing.pdf | |
Comment Resolution | ||||
Received comments (without responses) | 3av_0811_comments_d2_1_received.pdf | |||
Comments with proposed responses | 3av_0811_comments_d2_1_proposed.pdf | |||
Non-controversial comments for bulk acceptance | 3av_0811_comments_d2_1_consensus.pdf | |||
Comments with accepted responses | 3av_0811_comments_d2_1_accepted.pdf | |||
Comment Supplements (ordered by comment number) | ||||
1 | Pete Anslow | Nortel | Supplement to comment 2429 | 3av_0811_anslow_1.pdf |
2 | Hiroshi Hamano | Fujitsu Labs | Supplement to comments 2486 and 2487 | 3av_0811_hamano_1.pdf |
3 | Glen Kramer | Teknovus, Inc. | Supplement to comments 2586 and 2593 | 3av_0811_kramer_1.pdf |
4 | Glen Kramer | Teknovus, Inc. | Supplement to comments 2595, 2596, and 2598 | 3av_0811_kramer_2.pdf |
5 | Marek Hajduczenia | ZTE | Supplement to comment 2660 | 3av_0811_hajduczenia_1.pdf |
6 | Marek Hajduczenia | ZTE | Supplement to comment 2746 | 3av_0811_hajduczenia_3.pdf |
7 | Seiji Kozaki | Mitsubishi Electric | Supplement to comment 2761 | 3av_0811_kozaki_1.pdf |
8 | Seiji Kozaki | Mitsubishi Electric | Supplement to comment 2762 | 3av_0811_kozaki_2.pdf |
9 | Tsuji Shinji | Sumitomo Electric | Supplement to comment 2764 | 3av_0811_tsuji_1.pdf |
Presentation Materials (in order of submission) | ||||
1 | Marek Hajduczenia | ZTE | Power saving ad-hoc - Laser temperature stability analysis | 3av_0811_hajduczenia_2.pdf |
Post-deadline submissions | ||||
1 | Marek Hajduczenia | ZTE | Supplement to comments 2486, 2487, and 2564 | 3av_0811_hajduczenia_4.pdf |
2 | Marek Hajduczenia | ZTE | Supplement to comment 2746 | 3av_0811_hajduczenia_5.pdf |
3 | Ryan Hirth | Teknovus, Inc. | Supplement to comments 2715 and 202376 | 3av_0811_hirth_1.pdf |
4 | Jim Farmer | Enablence Technology | Supplement to comment 2663 | 3av_0811_farmer_1.pdf |
5 | Akio Tajima | NEC Corporation | Supplement to comment 2451 | 3av_0811_tajima_1.pdf |
6 | Hiroshi Hamano | Fujitsu Labs | Supplement to comment 2764 | 3av_0811_hamano_2.pdf |
7 | Ryan Hirth | Teknovus, Inc. | Supplement to comment 2753 | 3av_0811_hirth_2.pdf |
Submissions from the floor | ||||
1 | Tsuji Shinji | Sumitomo Electric | Updated supplement to comment 2764 (replaces 3av_0811_tsuji_1.pdf) | 3av_0811_tsuji_2.pdf |
2 | Ryan Hirth | Teknovus, Inc. | Supplement to comment 2715 | 3av_0811_hirth_3.pdf |
3 | Marek Hajduczenia | ZTE | Supplement to comment 2788 | 3av_0811_hajduczenia_6.pdf |
4 | Marek Hajduczenia | ZTE | Supplement to comment 201960 | 3av_0811_hajduczenia_7.pdf |
5 | Seiji Kozaki | Mitsubishi Electric | Supplement to comment 2762 | 3av_0811_kozaki_3.pdf |
6 | Marek Hajduczenia | ZTE | Supplement to comment 2486 | 3av_0811_hajduczenia_8.pdf |
7 | Marek Hajduczenia | ZTE | Supplement to comment 2663 | 3av_0811_hajduczenia_9.pdf |
8 | Frank Chang | Vitesse | Ethernet Alliance call for interest in plugfest | 3av_0811_chang_1.pdf |
9 | Glen Kramer | Teknovus, Inc. | Supplement to comments 2595, 2596, and 2598 (replaces 3av_0811_kramer_2.pdf) | 3av_0811_kramer_3.pdf |
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Last Update: November 26, 2008
Questions or comments: send e-mail to glen.kramer@ieee.org