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[802.3_NGEPON] http://www.ieee802.org/3/ca/3ca_presentproc.shtml

To: STDS-802-3-NGEPON@xxxxxxxxxxxxxxxxx
Subject: [802.3_NGEPON] http://www.ieee802.org/3/ca/3ca_presentproc.shtml
From: Duane Remein <duane.remein@xxxxxxxxxx>
Date: Fri, 7 Jul 2017 15:02:00 -0400
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-----------------------------------------

Presenter = Duane Remein
Affiliation = Huawei
SenderEmail = duane.remein@xxxxxxxxxx
Title = Progress Report on Envelope Header and Bonding
Summission = New_contribuion
Description = Current thinking on updates to MPRS SD's to accommodate  bonding scheme as discusses in Vancouver.
Time = 45 min


-----------------------------------------
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