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dear all, Here is the presentation from Peking University, China, for Feb.4th meeting. we now pay high attention to joining the EPOC meeting and really want to make some contribution to this group. If there is any questions regarding this, pls don't hesitate to contact me. BR, Lixia 2013/1/28 Shellhammer, Steve <sshellha@xxxxxxxxxxxxxxxx> > Here is a link to the IEEE-SA Patent Policy > * > https://development.standards.ieee.org/myproject/Public/mytools/mob/slideset.pdf > *<https://development.standards.ieee.org/myproject/Public/mytools/mob/slideset.pdf> > > > ......................................................................................................................................... > *Join online meeting* <https://meet.qti.qualcomm.com/sshellha/22LY1F9R> > *https://meet.qti.qualcomm.com/sshellha/22LY1F9R*<https://meet.qti.qualcomm.com/sshellha/22LY1F9R> > > Join by Phone > +1-858-658-1111 > *Find a local number* <https://dialin.qualcomm.com> > > Conference ID: 61483561 > > *Forgot your dial-in PIN?* <https://dialin.qualcomm.com> | *First > online meeting?*<http://r.office.microsoft.com/r/rlidOC10?clid=1033&p1=4&p2=1041&pc=oc&ver=4&subver=0&bld=7185&bldver=0> > > [!OC([1033])!] > > ......................................................................................................................................... > > > ------------------------------ > > ________________________________________________________________________ To unsubscribe from the STDS-802-3-EPOC list, click the following link: https://listserv.ieee.org/cgi-bin/wa?SUBED1=STDS-802-3-EPOC&A=1
Attachment:
EPoC TDD Proposal-Peking University.pptx
Description: application/vnd.openxmlformats-officedocument.presentationml.presentation