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Hi Ryan, You are right that the nAUI chip to chip
specification methodology in draft 1.1 can be leveraged to build retimed
modules. It just requires writing a chip to module specification somewhere
which specifies test points at the modules pins. The presentation you sent is
an excellent starting point for this and a lot of the XFI interface
specifications can be leveraged in writing the nAUI chip to module specifications.
Best Wishes for the New Year to Everyone Chris From: Ryan Latchman [mailto:Ryan.Latchman@xxxxxxxxxx] Hi Ali, Chris, This is an important discussion which
needs to get resolved quickly. I would like to ensure that XLAUI / CAUI
maintains its broad market applicability as a simple retimed interface. I
don’t think the current specification methodology prevents it from being
leveraged to build retimed modules. I’ve put together the attached
material to show how retimed interfaces were specified in the past (namely
XFI). In XFI, you’ll notice that the Before Connector and After
Connector specs are similar. 40/100GbE modules may have an analogous
situation, depending on their size and electrical characteristics. If we need to change the XLAUI / CAUI
specification, we need solid contributions on what needs to change. Happy Holidays, Ryan From: Ali Ghiasi [mailto:aghiasi@xxxxxxxxxxxx] Chris |