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[8023-POEP] IEEE 802.3at Midspan ad hoc meeting material Part 1



Hi all,  

The IEEE 802.3at, Midspan Ad hoc will meet at the following dates:

Wednesday Feb 27, 2008 at 9:00AM America/Los Angeles  time,

Wednesday March 12, 2008 at 9:00AM America/Los Angeles  time,

to discuss Midspan issues.

 

Please find attached the files containing the material for this meeting separated to two files (Part 1 and Part 2) which will sent in separate emails

in order not to pass the file size limit.

I'll Try to send the two parts combined together.

Please review and feel free to comment prior the meeting.

 

Please ensure that you review the IEEE-SA PatCom slides [ http://standards.ieee.org/board/pat/pat-slideset.pdf ] prior to the start of the conference call. At the start of call I will confirm that the patent slides have been reviewed by the participants - if anyone has not, we will pause the call until they confirm that they have done so.

Thanks,


Yair Darshan

 

Some of this discussion will be based on materials previously presented at;  

http://www.ieee802.org/3/at/public/jan08/darshan_5_0108.pdf

 

Phone Conference Details:

Meeting Starts at:

9:00AM America/Los Angeles  time

12:00 noon America/New York

17:00 PM London time

18:00 PM Barcelona/Berlin time

19:00PM Israel time

 

Length: up to 90 minutes

Participants pass code: 68331 #

Phone numbers:

From Israel: 03-9180699

From USA: 1-888-545-1212

From Britannia: 0-800-0282-120

From China: 10-800-972-0069

From Taiwan: 00-801-979-791

From South Korea: 00-798-972-124-20

From India: 000-800-972-1023

From Germany: 0-800-181-2770

From France: 0-800-909-462

From Portugal: 0-800-860-372

 

Additional Dial-in Numbers

 

Darshan Yair
Chief R&D Engineer

Analog Mixed Signal Group

Microsemi Corporation

 

1 Hanagar St., P.O. Box 7220
Neve Ne'eman Industrial Zone
Hod Hasharon 45421, Israel
Tel:  +972-9-775-5100,

Cell: +972-54-4893019
Fax: +972-9-775-5111

 

E-mail: <mailto:ydarshan@microsemi.com>.  

Midspan requirements below 1MHz - Feb 27 2008 2nd meeting Part 1.pdf