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Re: [802SEC] Face to Face EC meeting



I would suggest we determine this as soon as possible, especially if being international with respect to North America, where most of the EC participants reside. Reservations and approvals, especially for a second weekend, are going to need to be made way in advance.

BR
Clint


On Wed, Jul 27, 2022 at 11:06 AM, Jon Rosdahl
<jrosdahl@ieee.org> wrote:
It would be the 2023 Nov meeting as a possibility, but we could investigate any of the 2023 venues.
I did not note an action...so I guess I will need to look at the minutes again.
Jon
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IEEE 802 Executive Secretary   Qualcomm Technologies, Inc.
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On Wed, Jul 27, 2022 at 11:55 AM Clint Powell <cpowell@ieee.org> wrote:
I too recall there was talk about a workshop after the Nov. Bangkok mtg.

BR,
Clint P


On Wed, Jul 27, 2022 at 10:25 AM, Edward Au
Hi all,

Please correct me if I am wrong - I believe we were talking about a workshop after the November 2023 IEEE 802 plenary in Waikoloa, not the September 2022 IEEE 802 wireless interim in Waikoloa.

Regards,
Edward

On Wed, Jul 27, 2022 at 11:48 AM Geoff Thompson <thompson@ieee.org> wrote:
Glenn too.

On Wednesday, July 27, 2022, 08:46:45 AM PDT, Geoff Thompson <thompson@ieee.org> wrote:


Clint-

I believe that I suggested that San Francisco or Los Angeles areas would be the most practical place/compromise to get together post Waikoloa for 
    a) accessibility for non-wired folks, 
    b) easy stopover on the way home for most wireless folks.
but that there was no take-up on my suggestion nor further any action in any other direction.
Paul, David and John would still be subjected to lengthy travel
Therefore, my belief is that the matter has been dropped.

Geoff

On Wednesday, July 27, 2022, 07:36:15 AM PDT, Clint Chaplin <clint.chaplin@gmail.com> wrote:


Was any resolution reached regarding an EC face to face meeting in September?  I recall one possibility that a face to face meeting immediately after the wireless interim meeting was discussed, but I'm not sure if we reached a conclusion.

--
Clint Chaplin
Senior Principal Standards Engineer
Samsung Research America

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