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Dear Bo and Yinan, I volunteer to cover spec topic for security. Best regards, Hui Luo Infineon Technologies From:
亓祎男 <00001e2bb50f6a93-dmarc-request@xxxxxxxxxxxxxxxxx>
Dear Bo, The DCNs of the contributions to be presented in the next telco are as follows. 11-24/1613r8 Specification Framework for TGbp 11-25/0614r2 Proposed Specification Skeleton for TGbp D0.1 11-25/0613r2 TGbp Spec Text Topics and Volunteers Best regards, Yinan From:
sun.bo1@xxxxxxxxxxxxxxxx <sun.bo1@xxxxxxxxxxxxxxxx> Hello, all, With this email, I'd like to remind you of coming TGbp TC on May 27 and call for submissions for the teleconference. As usual, in the TC we will review the updated SFD incorporating approved motions in Warsaw meeting. We will also review the latest spec skeleton doc and
PDT topics. Then we will discuss potential submissions. The agenda of the TC will be uploaded to the server soon. Best Regards, Bo To unsubscribe from the STDS-802-11-TGBP list, click the following link:
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