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Re: [STDS-802-11-TGBP] reminder of TGbp teleconference on May 27



Dear Bo and Yinan,

 

I volunteer to cover spec topic for security.

 

Best regards,

 

Hui Luo

Infineon Technologies

 

 

From: 亓祎男 <00001e2bb50f6a93-dmarc-request@xxxxxxxxxxxxxxxxx>
Sent: Friday, May 23, 2025 1:54 AM
To: STDS-802-11-TGBP@xxxxxxxxxxxxxxxxx
Subject: Re: [STDS-802-11-TGBP] reminder of TGbp teleconference on May 27

 

CautionThis e-mail originated outside Infineon Technologies. Please be cautious when sharing information or opening attachments especially from unknown senders. Refer to our intranet guide to help you identify Phishing email.

 

Dear Bo,

 

The DCNs of the contributions to be presented in the next telco are as follows.

 

11-24/1613r8  Specification Framework for TGbp

11-25/0614r2  Proposed Specification Skeleton for TGbp D0.1

11-25/0613r2  TGbp Spec Text Topics and Volunteers

 

Best regards,

 

Yinan

 


From: sun.bo1@xxxxxxxxxxxxxxxx <sun.bo1@xxxxxxxxxxxxxxxx>
Sent: Friday, May 23, 2025 4:23 AM
To: STDS-802-11-TGBP@xxxxxxxxxxxxxxxxx
Subject: [STDS-802-11-TGBP] reminder of TGbp teleconference on May 27

 

Hello, all, 

 

With this email, I'd like to remind you of coming TGbp TC on May 27 and call for submissions for the teleconference. 

 

As usual, in the TC we will review the updated SFD incorporating approved motions in Warsaw meeting. We will also review the latest spec skeleton doc and PDT topics. Then we will discuss potential submissions. 

 

The agenda of the TC will be uploaded to the server soon. 

 

Best Regards,

Bo 

 

 

 

 

 

 


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