IEEE P802.3df & IEEE P802.3dj
Tools and Channel Data Area
IEEE P802.3df & IEEE P802.3djTools and Channel Data Area |
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Channel Data & Tools (IEEE P802.3ck 100 Gb/s Development)
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COM
4.1 Update (including supporting presentation) 15-Aug-2023 |
Rich Mellitz | Samtec |
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COM
4.0 Update (including supporting presentation) 23-Feb-2023 |
Rich Mellitz | Samtec |
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COM 3.9 Update 08-Nov 2022 (1.2 M) Supporting Presentation |
Rich Mellitz | Samtec |
200 Gb/s CR and KR channel data (TP0 to TP5) |
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212 Gb/s Per Lane PAM4 CR Channels with Flexible Host Architectures
and Longer Reach Cables - NIC Perspective 27-Nov-2023 Supporting Presentation |
Femi Akinwale Howard Heck Kent Lusted |
Intel |
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212 Gb/s Per Lane PAM4 CR Channels with Flexible Host Architectures
and Longer Reach Cables - Switch Perspective 27-Nov-2023 Supporting Presentation |
James Weaver Jason Chan |
Arista Networks |
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IEEE P802.3dj 200Gbps/lane Cabled Backplane Channels 25-Oct-2023 Supporting Presentation |
Femi Akinwale Howard Heck Arturo Pachon Cesar Mendex-Ruiz |
Intel |
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A 212.5 Gbps-PAM4 1 Meter DAC Long Reach Channel and Its
Characteristics: Design C 05-Oct-2023 Supporting Presentation |
Mike Li, Jenny Jiang, Hsinho Wu, Masashi Shimanouchi, Ilia Radashkevich, Itamar Levin, Ariel Cohen | Intel |
| Karan Jumani, Sina Bardikalaie, Vivek Shah, Scott Sommers | Molex | |
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212.5 Gbps-PAM4 1 Meter DAC Long Reach Channel: Design B
09-Jul-2023 Reference Presentation in zip file |
Mike Li, Jenny Jiang, Yi Heng Khor, Hsinho Wu, Masashi Shimanouchi, Ilia Radashkevich , Itamar Levin, Ariel Cohen | Intel |
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Nathan Tracy Megha Shanbhag |
TE Connectivity | |
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212.5 Gbps-PAM4 1 Meter DAC Long Reach Channel: Design A
09-Jul-2023 Reference Presentation in zip file |
Mike Li, Jenny Jiang, Yi Heng Khor, Hsinho Wu, Masashi Shimanouchi, Ilia Radashkevich , Itamar Levin, Ariel Cohen | Intel |
| Ali Hammoodi , Jose Paniagua, Michael Rowlands, Sam Kocsis | Amphenol | |
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212Gb/s Per Lane PAM4 KR Cabled Backplane Channels Room vs High
Temps 23-Jun-2023 Supporting Presentation |
James Weaver Jason Chan |
Arista Networks |
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Updated 200G Passive Copper Cable Assembly CR Channels 16-May-2023 Supporting Presentation |
Nathan Tracy Megha Shanbhag |
TE Connetivity |
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Updated KR Channels In Support of a 200G Backplane Objective 16-May-2023 Supporting Presentation |
Nathan Tracy Megha Shanbhag |
TE Connetivity |
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Copper Cable Channel Characteristics 12-May-2023 Supporting Presentation |
M. Rowlands A.Hammoodi Sam Kocsis J. Paniagua |
Amphenol |
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212Gb/s Per Lane PAM4 KR Cabled Backplane Channels with Asymmetric
NPC Cable Lengths 12-May-2023 Supporting Presentation |
James Weaver Jason Chan |
Arista Networks |
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KR NPC Cabled Backplane
(with managed crosstalk) 03-May-2023 Supporting Presentation |
Rich Mellitz Brandon Gore |
Samtec |
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Note - These files have been superseded by 16-May-2023 congtribution
from Tracy/Shanbhag Supporting Channel Analysis for a Backplane Objective 20-Mar-2023 Supporting Presentation |
Nathan Tracy Megha Shanbhag |
TE Connectivity |
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212Gb/s Per Lane PAM4 KR Cabled Backplane Channels 20-Mar-2023 Supporting Presentation |
Jim Weaver Jason Chan |
Arista Networks |
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KR NPC Cabled Backplane KR NPC Cabled Backplane (Crosstalk for a Lower Density) 20-Mar-2023 Supporting Presentation |
Rich Mellitz Brandon Gore |
Samtec |
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Note - These files have been superseded by 16-May-2023 congtribution
from Tracy/Shanbhag Characteristics of a Passive Direct Attach Copper Cable (DAC) Assembly in CR Channels with Various Host Architectures 09-Nov 2022 (21.7M) Supporting Presentation Original Contribution (contained port mapping error, fixed in 09-Nov 2022 Update, do not use) 25-July 2022 (25.7M) Supporting Presentation |
Nathan Tracy Megha Shanbhag |
TE Connectivity |
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A Collection of Cabled
Backplane Prototype Channels for 200Gb/s per lane for .3df PHY Type
Development 29-Apr-2022 (35.6M) Supporting Presentation |
Rich Mellitz | Samtec |
C2C |
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"C2C with 1 Connector" Topologies
(with crosstalk) 03-May-2023 Supporting Presentation |
Rich Mellitz Brandon Gore |
Samtec |
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"C2C with 1 Connector" Topologies 08-March-2023 Supporting Presentation |
Rich Mellitz Brandon Gore |
Samtec |
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Chip to Chip (C2C) Mezzanine
Test Board Channels (including supporting presentation) July-2022 |
Rich Mellitz Brandon Gore Tom Palkert |
Samtec |
C2M |
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C2M Channels for 200Gbps - Update to contributed channels 10-Jan-2024 Supporting Presentation |
Upen Reddy Kareti David Nozadze Pirooz Tooyserkani Yi Tang |
Cisco |
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C2M Cabled Host Channel Contribution with Skew Considerations
(Note - 612 MB file) 25-Oct-2023 Supporting Presentation |
Brandon Gore Rich Mellitz |
Samtec |
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A 212.5 Gbps-PAM4 Chip-to-Module Channel for “Universal Port” and
Its Characteristics: Design C 05-Oct-2023 Supporting Presentation |
Mike Li, Jenny Jiang, Hsinho Wu, Masashi Shimanouchi, Ilia Radashkevich, Itamar Levin, Ariel Cohen | Intel |
| Karan Jumani, Sina Bardikalaie, Vivek Shah, Scott Sommers |
Molex |
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200G AUI C2M System Applicationand Channel Model Contribution
12-Sept 2023 Supporting Presentation |
Upen Reddy Kareti Yi Tang Darja Padilla |
Cisco |
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212Gb/s Per Lane PAM4 Chip-to-Module Conventional Channels Room vs.
Hi Temp 29-Aug 2023 Supporting Presentation |
James Weaver Jason Chan |
Arista Networks |
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IEEE P802.3df Channel Models for 200 Gbps/Lane AUI C2M - 85 ohms
IEEE P802.3df Channel Models for 200 Gbps/Lane AUI C2M - 93 ohms IEEE P802.3df Channel Models for 200 Gbps/Lane AUI C2M - 100 ohms 10-Jul-2023 Supporting Presentation |
Femi Akinwale Cesar Mendez-Ruiz Arturo Pachon Kusuma Matta Howard Heck |
Intel |
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212.5 Gbps-PAM4 Chip-to-Module Channel: Design B 09-Jul-2023 Reference Presentation in zip file |
Mike Li, Jenny Jiang, Yi Heng Khor, Hsinho Wu, Masashi Shimanouchi, Ilia Radashkevich , Itamar Levin, Ariel Cohen | Intel |
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Nathan Tracy Megha Shanbhag |
TE Connetivity | |
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212.5 Gbps-PAM4 Chip-to-Module Channel: Design A 09-Jul-2023 Reference Presentation in zip file |
Mike Li, Jenny Jiang, Yi Heng Khor, Hsinho Wu, Masashi Shimanouchi, Ilia Radashkevich , Itamar Levin, Ariel Cohen | Intel |
| Ali Hammoodi, Jose Paniagua, Michael Rowlands, Sam Kocsis | Amphenol | |
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Updated 200G Chip to Module Channels
16-May 2023 Supporting Presentation |
Nathan Tracy Megha Shanbhag |
TE Connetivity |
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212 Gb/s PAM4 per Lane C2M Channels A Via Length Performance Orthogonal Breakout Parallel Breakout 24-Jan-2023 Supporting Presentation |
Rick Rabinovich |
Keysight |
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Note - These files have been superseded by 16-May-2023 congtribution
from Tracy/Shanbhag Characteristics of a 224Gbps Chip to Module Channel with Various Host Architectures 09-Nov 2022 (37.5M) Supporting Presentation |
Nathan Tracy Megha Shanbhag |
TE Connectivity |
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IEEE
P802.3df Channel Models for 200 Gbps/Lane AUI C2M - 85 ohms IEEE P802.3df Channel Models for 200 Gbps/Lane AUI C2M - 93 ohms IEEE P802.3df Channel Models for 200 Gbps/Lane AUI C2M - 100 ohms 19-Sept-2022 Supporting Presentation |
Femi Akinwale
Cesar Mendez-Ruiz Arturo Pachon Kusuma Matta Howard Heck |
Intel |
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212
Gb/s PAM4 per Lane C2M Channels - Orthogonal 212 Gb/s PAM4 per Lane C2M Channels - Parallel 19-Sept-2022 Supporting Presentation |
Rick Rabinovich |
Keysight |
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200G/lane Host to Module
Short Channels 29-Apr-2022 (17.9M) Supporting Presentation |
Femi Akinwale
Kusuma Matta Oleg Kashurkin Cesar Mendez-Ruiz Howard Heck Francisco Olguin Tellez |
Intel |
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200G PAM4 C2M Technical
Feasibilit 02-Mar-2022 (14.5M) Supporting Presentation |
Rick Rabinovich | Keysight |
Return to the IEEE P802.3df Public Area
Last Update: 10 Jan 2024
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