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Hello All – We’ve received 1 request for re-opening a closed comment (Comment #157). Please see and respond to the email for this discussion, I will bring that email to the top of your inbox momentarily. I’m very pleased with how the telephonic interim went last week. Again,
I cannot stress this enough, preparation is NECESSARY for these calls!!
So, please
prepare, prepare, prepare! Here is the proposed agenda for Wednesday’s (3/25) Telephonic Interim:
Please note that we may not get through this entire list of the comments. If time runs out, we will work with Matt to adjust future meeting agendas. *Although other comments may relate to these topics, these are the comments we will focus on closing at this meeting. Thank you all for your dedication to our industry! Cheers, Beth Please be familiar with IEEE policies prior to the call: IEEE patent policy - http://www.ieee802.org/3/patent.html and
http://standards.ieee.org/about/sasb/patcom/materials.html Participant policy -
http://www.ieee802.org/devdocs.shtml Copyright policy -
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